The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2001
Filed:
Oct. 28, 1999
Yuji Iino, Kokubu, JP;
Riichi Sasamori, Kokubu, JP;
Katsura Hayashi, Kokubu, JP;
Masaaki Hori, Kokubu, JP;
Hidenori Shikada, Kokubu, JP;
Masaaki Harazono, Kokubu, JP;
Kyocera Corporation, Kyoto, JP;
Abstract
A wiring board comprising an insulating substrate containing at least an organic resin, a plurality of electrically conducting wiring layers formed on the surface and/or inside of said insulting substrate, and via-hole conductors formed in said insulating substrate in order to electrically connect the plurality of electrically conducting wiring layers, wherein said via-hole conductors contain an organic binder as well as a Cu—Sn intermetallic compound as an electrically conducting component. The via-hole conductors formed in the wiring board exhibit a high electric conductivity and a large heat resistance, making it possible to very highly reliably connect the electrically conducting wiring layers together.