The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2015
Filed:
Sep. 26, 2012
Applicant:
Kyocera Slc Technologies Corporation, Yasu-shi, Shiga, JP;
Inventors:
Masaaki Harazono, Yasu, JP;
Yoshihiro Hosoi, Yasu, JP;
Assignee:
KYOCERA SLC Technologies Corporation, Shiga, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/03 (2006.01); H05K 3/10 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); H05K 3/107 (2013.01); H05K 1/0366 (2013.01); H05K 3/0044 (2013.01); H05K 3/427 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/10674 (2013.01); H05K 2203/025 (2013.01); H01L 2224/16225 (2013.01);
Abstract
A printed circuit board of the present invention includes a base body, a through-hole that penetrates through the base body in the thickness direction, and a through-hole conductor that covers an inner wall of the through-hole. The base body has a fiber layer including a plurality of glass fibers and a resin that covers the plurality of glass fibers. The glass fibers have a groove-shaped concavity on a surface exposed to the inner wall of the through-hole. The concavity is filled with a part of the through-hole conductor.