The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2014
Filed:
Apr. 27, 2011
Applicants:
Masaaki Harazono, Yasu, JP;
Takayuki Umemoto, Yasu, JP;
Inventors:
Masaaki Harazono, Yasu, JP;
Takayuki Umemoto, Yasu, JP;
Assignee:
Kyocera Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/10 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4644 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/09536 (2013.01); H05K 2201/0959 (2013.01); H05K 2203/0307 (2013.01);
Abstract
According to one embodiment of the invention, a method for manufacturing a circuit board comprises covering with a metal layer a surface of a first resin layer including polyimide resin; forming a plurality of conductive layers arranged on the metal layer with the conductive layers apart from each other in a planer view; roughening surfaces of the conductive layers with an alkaline aqueous solution; and etching a part of the metal layer between the conductive layers in the planer view to expose the surface of the first resin layer after roughening the surfaces of the conductive layers.