Kyocera Corporation

Kyocera Slc Technologies Corporation

Masaaki Harazono

Takayuki Umemoto

Yoshihiro Hosoi

Katsura Hayashi

Toshihiro Matsumoto

Masaharu Shirai

Hidetoshi Yugawa

Riichi Sasamori

Yuji Iino

Masaaki Hori

Takayuki Nejime

Hidenori Shikada

A wiring board includes a first insulating layer including a surface having unevenness, a second insulating layer including a surface having unevenness, laminated on the first insulating layer, and made of the same insulating material as that of the first insulating layer, insulating particles contained in the first and second insulating layers at rate of 40 to 80 wt %, a first wiring conductor on a first underlying metal layer surface, and a second wiring conductor on a second underlying metal layer surface. A second level difference of the unevenness in a surface region of the second insulating layer under the second wiring conductor is smaller than a first level difference of the unevenness in a surface region of the first insulating layer under the first wiring conductor, and the second level difference is not more than &#x2156; of an average particle size of the insulating particles.

Wiring board

A wiring board includes an insulating layer made of an insulating resin containing inorganic insulating particles, a groove positioned in a surface of the insulating layer and including a wall surface being perpendicular to the surface of the insulating layer, and a wiring conductor filled in the groove, wherein a cross-section of the insulating resin and cross-sections of the inorganic insulating particles are exposed at the wall surface in flush with each other.

Wiring board and manufacturing method for same

A wiring board includes a laminate in which at least one first insulating layer containing first insulating particles and a first insulating resin, and at least one second insulating layer containing second insulating particles having a particle size smaller than a particle size of the first insulating particles and a second insulating resin are alternately positioned; a groove for wiring positioned at least on an upper surface of the laminate and including a side surface and a bottom surface; a via hole positioned in the first insulating layer of the laminate; and a wiring conductor positioned in the groove for wiring and in the via hole. The bottom surface of the groove for wiring is positioned in the second insulating layer.

Wiring board and method for manufacturing the same

The wiring board of the present disclosure includes an insulating layer, and a wiring conductor existing so as to be adjacent to both main surfaces of the insulating layer; the insulating layer includes at least two particle-containing resin layers containing insulating particles in an insulating resin, and a particle-free resin layer formed of an insulating resin; and the particle-free resin layer is interposed between the particle-containing resin layers.

A printed circuit board of the present invention includes a base body, a through-hole that penetrates through the base body in the thickness direction, and a through-hole conductor that covers an inner wall of the through-hole. The base body has a fiber layer including a plurality of glass fibers and a resin that covers the plurality of glass fibers. The glass fibers have a groove-shaped concavity on a surface exposed to the inner wall of the through-hole. The concavity is filled with a part of the through-hole conductor.

Printed circuit board, mount structure thereof, and methods of producing these

A wiring board of the present invention includes a substrate including a woven fabric formed of a plurality of glass fibers and a resin covering the woven fabric; a plurality of through holes T penetrating through the substrate in a thickness direction thereof; and a plurality of through hole conductors adhered to inner walls of the through holes T respectively. The through holes T include a first through hole and a second through hole, and, in the woven fabric, the number of the glass fibers through which the first through hole penetrates is larger than the number of the glass fibers through which the second through hole penetrates. In the first and second through holes, portions thereof having narrowest widths are surrounded by the woven fabric, and the narrow width portion of the first through hole is smaller than the narrow width portion of the second through hole.

Wiring board and mounting structure using the same

According to one embodiment of the invention, a method for manufacturing a circuit board comprises covering with a metal layer a surface of a first resin layer including polyimide resin; forming a plurality of conductive layers arranged on the metal layer with the conductive layers apart from each other in a planer view; roughening surfaces of the conductive layers with an alkaline aqueous solution; and etching a part of the metal layer between the conductive layers in the planer view to expose the surface of the first resin layer after roughening the surfaces of the conductive layers.

Method for manufacturing circuit board and method for manufacturing structure using the same

A circuit board comprises a substrate; a through hole penetrating the substrate along with a direction of a thickness thereof; and a through hole conductor covering an inner wall of the through hole. The substrate comprises a first fiber layer, a second fiber layer, and a resin layer arranged between the first fiber layer and the second fiber layer. Each of the first fiber layer and the second fiber layer has a plurality of fibers and a resin arranged among the plurality of the fibers. The resin layer contains a resin and doesn't contain a fiber. The inner wall of the through hole, in a cross-section view along with the direction of the thickness of the substrate, comprises a curved depression in the resin layer.

Circuit board and mounting structure using the same

According to the present invention, a method for manufacturing a prepreg sheet includes steps of (A) forming a resin layeron a surface of a supporter, (B) winding a reinforcing yarnaround the resin layer, and (C) embedding at least a part of the reinforcing yarnin the resin layer. Preferably, in step (C), the surface of the supporteris relatively moved towards the reinforcing yarn

Method and apparatus for manufacturing prepreg sheet and prepreg sheet

A fiber-reinforced resin is provided which includes a fiber bundlecomprising a plurality of monofilament layers, andbeing laminated, each of the monofilament layers comprising a plurality of monofilamentsarranged in one direction and an adhesivefor adhering the monofilamentsof the fiber bundletogether, and the fiber bundlehas a honeycomb-shaped cross section.

Fiber-reinforced resin and method for manufacturing the same

A wiring board comprising an insulating substrate containing at least an organic resin, a plurality of electrically conducting wiring layers formed on the surface and/or inside of said insulting substrate, and via-hole conductors formed in said insulating substrate in order to electrically connect the plurality of electrically conducting wiring layers, wherein said via-hole conductors contain an organic binder as well as a Cu&mdash;Sn intermetallic compound as an electrically conducting component. The via-hole conductors formed in the wiring board exhibit a high electric conductivity and a large heat resistance, making it possible to very highly reliably connect the electrically conducting wiring layers together.

A photosemiconductor device-housing package comprising a metal substrate; an insulating support member on the top surface of which a photosemiconductor device is mounted; a metal frame member attached onto the metal substrate so as to surround the insulating support member and having a fixing region through its side face which fixes an optical fiber therein; outer lead terminals fixed in the metal substrate or the metal frame member via insulants; and a metal lid member attached to the top surface of the metal frame member to hermetically seal the photosemiconductor device, wherein the insulating support member is composed of an aluminum nitride-based sinter, the top surface of the insulating support member is coated with a thin-film brazing material, and the photosemiconductor device is fixed onto the insulating support member via the brazing material.

Growing community of inventors

Kirishima, Japan

Masaaki Harazono