Kyocera Corporation

Kyocera Circuit Solutions Inc.

Hidetoshi Yugawa

Masaaki Harazono

Yoshihiro Hosoi

Takayuki Umemoto

Takashi Ishioka

Takayuki Taguchi

Tsuyoshi Sunada

A wiring board according to the present disclosure includes a first insulation layer including a first surface, a land located on the first insulation layer and including a second surface, a second insulation layer located at the first surface of the first insulation layer and including a via hole extending over the second surface of the land, and a via-hole electrical conductor located in the via hole. The land includes a plurality of recessed portions on the second surface, and at least one recessed portion selected from the plurality of recessed portions includes a buffer body containing resin. The via-hole electrical conductor is in contact with the second surface of the land and the buffer body.

Wiring board

A wiring board includes: first and second insulating layers; a first wiring conductor layer located between the first and second insulating layers and including a first via land; a second wiring conductor layer located on the second insulating layer and including a second via land; a via hole penetrating from the upper to lower surfaces of the second insulating layer; and a via conductor located in the via hole and electrically connecting the first second via lands. The via conductor is located on the inner surface of the via hole and on the first via land via a first base layer containing nichrome and a second base layer located on the upper surface of the first base layer and containing the same metal as the via conductor. An alloy layer containing tin and nichrome is located between the first via land and the first base layer.

A wiring board of the present disclosure comprises an insulating layer, a first conductor layer located on the surface of the insulating layer and containing any one of nickel and chromium, a metal belonging to group of the periodic table; or a metal belonging to group of the periodic table, a second conductor layer located inside the outer circumferential edge on the first conductor layer and containing copper, a third conductor layer located on the surface of the insulating layer in a state of covering the first conductor layer and the second conductor layer and containing nickel, and a fourth conductor layer located in a state of covering the third conductor layer and containing gold. The third conductor layer has an overhanging part extending outward from the outer circumferential edge of the first conductor layer, and the fourth conductor layer is located between the overhanging part and the insulating layer.

A wiring board of the present disclosure includes: a first insulating layer including a surface; a second insulating layer including un upper surface and a lower surface and locating above the surface of the first insulating layer; a wiring conductor layer formed on the surface of the first insulating layer, includes a via land; and a via hole conductor penetrating from the upper surface to the lower surface of the second insulating layer. The via hole conductor includes a via bottom being in contact with the via land. Crystal grains in the via bottom are smaller than crystal grains in the via land.

The printed wiring board of the present disclosure includes: a plurality of insulating layers laminated in a thickness direction; a plurality of wiring conductors respectively correspondingly positioned between the plurality of insulating layers; a through hole penetrating the plurality of insulating layers and the plurality of wiring conductors in the thickness direction; and a through-hole conductor positioned on a wall surface of the through hole; each of the plurality of wiring conductors has a first surface facing the through hole, each of the plurality of insulating layers has a second surface facing the through hole, and the first surface is farther away from a central axis penetrating the through hole in the thickness direction than the second surface.

Printed wiring board

A wiring board includes a first insulating layer including a surface having unevenness, a second insulating layer including a surface having unevenness, laminated on the first insulating layer, and made of the same insulating material as that of the first insulating layer, insulating particles contained in the first and second insulating layers at rate of 40 to 80 wt %, a first wiring conductor on a first underlying metal layer surface, and a second wiring conductor on a second underlying metal layer surface. A second level difference of the unevenness in a surface region of the second insulating layer under the second wiring conductor is smaller than a first level difference of the unevenness in a surface region of the first insulating layer under the first wiring conductor, and the second level difference is not more than &#x2156; of an average particle size of the insulating particles.

A wiring board according to the present invention includes an insulating board; a first pad provided inwardly from a surface of the insulating board and electrically connected to an electrode of an electronic component; a second pad provided on the surface of the insulating board and electrically connected to a lead terminal. The first pad and the second pad include a first layer region made of copper and a second layer region arranged on the first layer region and made of nickel, and a thickness of the second layer region of the second pad is larger than a thickness of the second layer region of the first pad.

Wiring board and electronic device using the same

A wiring boardincludes a lower wiring conductor, an upper insulating layerlaminated on the lower wiring conductorand having a via holewhere a bottom surface is the lower wiring conductor, and a via conductorconnected to the lower wiring conductorand filling the via hole; and the upper insulating layerincludes a first resin layerand a second resin layersequentially laminated on the lower wiring conductor, the via holehas an annular grooveover a whole circumference of the inner wall in a boundary between both resin layersand, and the via conductorfills the groove

Wiring board and method of manufacturing the same

A circuit board provided with a first resin layer and with a first conductive layer formed on the first resin layer. The first conductive layer has a metal carbide layer containing a carbide of a transition metal selected from Group IV, Group V, or Group VI in the Periodic Table and bonded to the first resin layer. The first resin layer has a first region to which the metal carbide layer is bonded and a second region located in an inner portion of the first resin layer from the first region. The first region has a larger ratio of number of atoms of nitrogen relative to number of atoms of carbon than in the second region.

Wiring board and mount structure

A circuit board includes an insulating layer and a conductive layer formed on the insulating layer. The insulating layer contains a resin with high heat resistance. The conductive layer includes a metal carbide layer bonded to the insulating layer and containing a carbide of a first metal in group IV, V, or VI of the periodic table, and a first metal layer bonded to the metal carbide layer and containing the first metal.

Growing community of inventors

Kyoto, Japan

Hidetoshi Yugawa