The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Sep. 29, 2010
Applicant:
Hidetoshi Yugawa, Shiga, JP;
Inventor:
Hidetoshi Yugawa, Shiga, JP;
Assignee:
Kyocera Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 3/388 (2013.01); H05K 2203/095 (2013.01); H05K 3/421 (2013.01); H05K 3/4602 (2013.01); H05K 3/381 (2013.01); H05K 2201/0175 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/0323 (2013.01); H05K 3/4644 (2013.01);
Abstract
A circuit board provided with a first resin layer and with a first conductive layer formed on the first resin layer. The first conductive layer has a metal carbide layer containing a carbide of a transition metal selected from Group IV, Group V, or Group VI in the Periodic Table and bonded to the first resin layer. The first resin layer has a first region to which the metal carbide layer is bonded and a second region located in an inner portion of the first resin layer from the first region. The first region has a larger ratio of number of atoms of nitrogen relative to number of atoms of carbon than in the second region.