The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2016
Filed:
Jun. 26, 2013
Applicant:
Kyocera Slc Technologies Corporation, Yasu-shi, Shiga, JP;
Inventors:
Assignee:
Kyocera Corporation, Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/113 (2013.01); H05K 3/4602 (2013.01); H05K 2201/099 (2013.01); H05K 2201/09436 (2013.01); H05K 2201/09736 (2013.01); H05K 2201/1034 (2013.01); H05K 2201/10674 (2013.01);
Abstract
A wiring board according to the present invention includes an insulating board; a first pad provided inwardly from a surface of the insulating board and electrically connected to an electrode of an electronic component; a second pad provided on the surface of the insulating board and electrically connected to a lead terminal. The first pad and the second pad include a first layer region made of copper and a second layer region arranged on the first layer region and made of nickel, and a thickness of the second layer region of the second pad is larger than a thickness of the second layer region of the first pad.