The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2022
Filed:
Jul. 25, 2019
Applicant:
Kyocera Corporation, Kyoto, JP;
Inventors:
Tsuyoshi Sunada, Satsumasendai, JP;
Hidetoshi Yugawa, Kyoto, JP;
Assignee:
KYOCERA CORPORATION, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/291 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/5383 (2013.01); H05K 3/0029 (2013.01);
Abstract
A wiring board of the present disclosure includes: a first insulating layer including a surface; a second insulating layer including un upper surface and a lower surface and locating above the surface of the first insulating layer; a wiring conductor layer formed on the surface of the first insulating layer, includes a via land; and a via hole conductor penetrating from the upper surface to the lower surface of the second insulating layer. The via hole conductor includes a via bottom being in contact with the via land. Crystal grains in the via bottom are smaller than crystal grains in the via land.