The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Sep. 22, 2022
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventor:

Hidetoshi Yugawa, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/03 (2013.01); H05K 2201/0266 (2013.01);
Abstract

A wiring board according to the present disclosure includes a first insulation layer in which first insulating fillers are dispersed, and a second insulation layer located on an upper surface of the first insulation layer. The first insulation layer includes a protruding filler located protruding from the upper surface of the first insulation layer among the first insulating fillers and a coating film covering a part or all of a protruding surface of the protruding filler. The coating film has a structure in which a tin layer and a silane coupling agent layer are layered in this order. The second insulation layer covers the upper surface of the first insulation layer including the coating film.


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Yugawa, Hidetoshi. (2026). Wiring board (U.S. Patent No. 12739972). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12739972

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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