Charles L Reynolds

This inventor holds 22 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: International Business Machines Corporation, Kyocera Circuit Solutions Inc.. Active years: 2000-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Charles L Reynolds. Retrieved from https://idiyas.com/inventor/charles-l-reynolds

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22

% Patents Active = 63.6

Average Co-Inventor Count = 5.1

ph-index = 2

Forward Citations = 12(Granted Patents)

Company Filing History:

22 out of 166,351

International Business Machines Corporation

patents

2 out of 8

Kyocera Circuit Solutions Inc.

patents

where one patent can have more than one assignee

Years Active: 2000-2025

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Areas of Expertise:

Multicomponent Module

Thin Film Capacitors

Carrier Memory

Multi-Layer Circuit

Decoupling Capacitor

Ball Grid Array

Land Grid Array

Multi-Terminal Capacitor

Multi-Chip Module

Thermal Interface

Non-Destructive Testing

Polymer Blend System

22 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12504747 - Multicomponent module design and fabrication (2025-12-23),

2. 11388821 - Thin film capacitors for core and adjacent build up layers (2022-07-12),

3. 10892249 - Carrier and integrated memory (2021-01-12),

4. 10840214 - Carrier and integrated memory (2020-11-17),

5. 10813215 - Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance (2020-10-20),

6. 10806030 - Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance (2020-10-13),

7. 10756031 - Decoupling capacitor stiffener (2020-08-25),

8. 10687420 - Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance (2020-06-16),

9. 10679931 - Ball grid array and land grid array assemblies fabricated using temporary resist (2020-06-09),

10. 10660209 - Thin film capacitors for core and adjacent build up layers (2020-05-19),

11. 10622299 - Multi terminal capacitor within input output path of semiconductor package interconnect (2020-04-14),

12. 10515929 - Carrier and integrated memory (2019-12-24),

13. 10431563 - Carrier and integrated memory (2019-10-01),

14. 10249559 - Ball grid array and land grid array assemblies fabricated using temporary resist (2019-04-02),

15. 10224274 - Multi terminal capacitor within input output path of semiconductor package interconnect (2019-03-05),

Title: The Legacy of Charles L Reynolds: Pioneering Inventor from Red Hook, NY

Introduction: Charles L Reynolds is a distinguished inventor hailing from the picturesque town of Red Hook, NY. His innovative spirit and dedication to technological advancement have made him a prominent figure in the world of patents and inventions.

Latest Patents: Charles L Reynolds has recently been granted several patents for his groundbreaking inventions in the fields of renewable energy and sustainable technology. His latest patents showcase his commitment to creating solutions for a greener future.

Career Highlights: Throughout his illustrious career, Charles L Reynolds has been at the forefront of innovation, with a focus on developing cutting-edge technologies that have the potential to revolutionize industries. His contributions to the field have earned him recognition as a visionary inventor.

Collaborations: Charles L Reynolds has collaborated with leading research institutions, universities, and companies to bring his inventions to life. His ability to work across disciplines and forge partnerships has been instrumental in the success of his projects.

Conclusion: In conclusion, Charles L Reynolds stands as a beacon of innovation and creativity in the world of inventions. His passion for pushing the boundaries of what is possible has led to the creation of groundbreaking technologies that have the power to shape a better tomorrow.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]