The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

Nov. 14, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Charles L. Arvin, Poughkeepsie, NY (US);

Brian W. Quinlan, Poughkeepsie, NY (US);

Charles L. Reynolds, Red Hook, NY (US);

Jean Audet, Granby, CA;

Francesco Preda, New Braunfels, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01G 4/33 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 3/00 (2006.01); H05K 3/30 (2006.01); H05K 1/16 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01G 4/33 (2013.01); H05K 1/0231 (2013.01); H05K 1/115 (2013.01); H05K 1/162 (2013.01); H05K 1/181 (2013.01); H05K 3/0047 (2013.01); H05K 3/303 (2013.01); H05K 3/4038 (2013.01); H05K 2201/09581 (2013.01); H05K 2201/10015 (2013.01); H05K 2203/107 (2013.01);
Abstract

A method includes affixing a capacitor sheet adjacent to core material of a device substrate, where the capacitor sheet covers a surface of the core material. The method also includes patterning first openings through both capacitor sheet and the core material, where the first openings are larger than a substrate pass through-hole. The method additionally includes filling the first openings with an electrically inert material. The method further includes patterning a second openings parallel to the first openings through the electrically inert material, where the second openings are at least as large as the substrate pass through-hole and having sidewalls enclosed within the electrically inert material.


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