IDiyas

For the Inventor, By the Inventor

New Braunfels, TX, United States of America

Francesco Preda

USPTO Granted Patents = 11 

Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 15(Granted Patents)


Location History:

  • Mozzo, IT (2006)
  • New Braunfels, TX (US) (2011 - 2022)

Company Filing History:

goldMedal11 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 2006-2025

where 'Filed Patents' based on already Granted Patents

11 patents (USPTO):
1. 12266598 - Dense via pitch interconnect to increase wiring density (2025-04-01),
2. 11388821 - Thin film capacitors for core and adjacent build up layers (2022-07-12),
3. 10956649 - Semiconductor package metal shadowing checks (2021-03-23),
4. 10660209 - Thin film capacitors for core and adjacent build up layers (2020-05-19),
5. 10423752 - Semiconductor package metal shadowing checks (2019-09-24),
6. 8722536 - Fabrication method for circuit substrate having post-fed die side power supply connections (2014-05-13),
7. 8716851 - Continuously referencing signals over multiple layers in laminate packages (2014-05-06),
8. 8586476 - Fabrication method for circuit substrate having post-fed die side power supply connections (2013-11-19),
9. 8158461 - Continuously referencing signals over multiple layers in laminate packages (2012-04-17),
10. 7863724 - Circuit substrate having post-fed die side power supply connections (2011-01-04),
11. 7015574 - Electronic device carrier adapted for transmitting high frequency signals (2006-03-21),

Title: Innovations of Francesco Preda: Pioneering Advances at IBM

Introduction: Francesco Preda, an accomplished inventor based in New Braunfels, TX, has made significant contributions to the field of integrated circuit technology. With a robust portfolio of 11 patents, he has demonstrated his ingenuity and commitment to advancing electronic design and manufacturing processes.

Latest Patents: Among Francesco's latest innovations are two noteworthy patents. The first, titled "Dense via pitch interconnect to increase wiring density," focuses on an enhanced integrated circuit interconnect package. This invention allows for increased routing density per layer while maintaining signal integrity performance. It features a differential signal via pair of vertical interconnect vias positioned closely together, optimizing space and enhancing available wiring signal channels.

The second patent, "Thin film capacitors for core and adjacent build-up layers," describes a device substrate that incorporates a core material with an adjoining capacitor sheet. This innovation facilitates the integration of capacitors and substrate pass through-holes, which improves functionality and performance in electronic devices.

Career Highlights: Francesco Preda has built his career at the International Business Machines Corporation (IBM), one of the world's leading technology companies. His work revolves around the design and development of advanced electronic components that are vital for modern computing applications.

Collaborations: Throughout his career, Francesco has collaborated with esteemed colleagues, such as Lloyd Andre Walls and Daniel Douriet. Together, they have contributed to breakthroughs in integrated circuit designs and have fostered a culture of innovation at IBM.

Conclusion: Francesco Preda's impressive body of work exemplifies his dedication to improving technology through inventive solutions. His contributions at IBM not only enhance product performance but also push the boundaries of what is possible in integrated circuit technology. As the demand for advanced electronics continues to grow, Francesco's innovations will undoubtedly play a significant role in shaping the future.

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