The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2025
Filed:
Oct. 24, 2022
International Business Machines Corporation, Armonk, NY (US);
Francesco Preda, New Braunfels, TX (US);
Sungjun Chun, Austin, TX (US);
Jose A. Hejase, Pflugerville, TX (US);
Junyan Tang, Austin, TX (US);
Pavel Roy Paladhi, Pflugerville, TX (US);
Nam Huu Pham, Round Rock, TX (US);
Wiren Dale Becker, Hyde Park, NY (US);
Daniel Mark Dreps, Georgetown, TX (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An enhanced integrated circuit interconnect package, method and multiple-layer integrated circuit laminate structure enable increased routing density per layer and maintains signal integrity performance. A differential signal via pair of vertical interconnect vias provide differential signaling. The vias of the differential signal via pair are positioned closely spaced together with each via offset from a center axis of an associated LGA contact, minimizing space between the differential signal vias and maintaining signal integrity performance, and providing increased available wiring signal channel.