Wiren Dale Becker

Title: Innovations and Patents of Wiren Dale Becker

Introduction

Wiren Dale Becker, based in Hyde Park, NY, is an accomplished inventor holding a remarkable portfolio of 46 patents. His contributions primarily lie within the field of integrated circuits and printed circuit boards, showcasing innovative solutions that enhance signal integrity and wiring density.

Latest Patents

Some of his latest innovations include:

1. **Dense via pitch interconnect to increase wiring density** - This patent presents an enhanced integrated circuit interconnect package and a multilayer integrated circuit laminate structure. It enables increased routing density per layer while maintaining performance integrity. The design features a pair of vertical interconnect vias that facilitate differential signaling, minimizing space between the differential signal vias and ensuring signal integrity is preserved.

2. **Vertically transitioning between substrate integrated waveguides (SIWs) within a multilayered printed circuit board (PCB)** - This innovation addresses the challenge of signal transition within multilayer PCBs. It outlines methods and apparatuses that allow a signal to transition between substrate integrated waveguides, utilizing an aperture in the ground plane of the PCB. This design ensures an effective signal transmission across different layers while efficiently using space.

Career Highlights

Wiren Becker is a key figure at the International Business Machines Corporation (IBM), where his technical expertise and innovative thinking have significantly contributed to the advancement of electronic communication technologies. His patents reflect his dedication to improving the efficiency and effectiveness of integrated circuits.

Collaborations

Throughout his career, Becker has collaborated with notable colleagues such as Daniel Mark Dreps and Jose A. Hejase, enhancing the collaborative innovation environment at IBM. These partnerships have fostered the development of groundbreaking technologies in the field.

Conclusion

With an impressive array of patents and a solid career at IBM, Wiren Dale Becker continues to push the boundaries of innovation in integrated circuits and multilayer printed circuit boards. His work not only demonstrates technical excellence but also has a lasting impact on the future of electronic engineering.