The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Aug. 26, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Wiren D. Becker, Hyde Park, NY (US);

William L. Brodsky, Binghamton, NY (US);

Matteo Cocchini, Long Island City, NY (US);

Michael A. Cracraft, Poughkeepsie, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/51 (2011.01); H01R 43/28 (2006.01); H01R 12/73 (2011.01); H05K 1/11 (2006.01); H01R 43/20 (2006.01);
U.S. Cl.
CPC ...
H01R 12/737 (2013.01); H01R 43/205 (2013.01); H05K 1/112 (2013.01); H05K 2201/094 (2013.01);
Abstract

A dual in-line memory module (DIMM) connector system is provided. The DIMM connector system includes a motherboard, a DIMM card and a connector by which the DIMM card is coupled with the motherboard. The motherboard includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, ground pads disposed proximate to signal pads, signal vias connected to distal edges of signal pads and shared antipads. The DIMM card includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, signal vias connected to distal edges of signal pads and shared antipads for respective pairs of signal vias.


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