The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Dec. 15, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Jose A. Hejase, Austin, TX (US);

Wiren D. Becker, Hyde Park, NY (US);

Daniel Dreps, Georgetown, TX (US);

Sungjun Chun, Austin, TX (US);

Brian Beaman, Cary, NC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/00 (2006.01); H05K 3/00 (2006.01); H01R 12/70 (2011.01); H01R 12/71 (2011.01); H01R 43/18 (2006.01); H01R 43/20 (2006.01); H01R 13/24 (2006.01);
U.S. Cl.
CPC ...
H01R 12/7076 (2013.01); H01R 12/716 (2013.01); H01R 13/245 (2013.01); H01R 43/18 (2013.01); H01R 43/205 (2013.01); Y10T 29/49147 (2015.01);
Abstract

Embodiments of the present invention include a method for fabricating a hybrid land grid array connector and the resulting structures. A body is provided. The body includes a first plurality of holes and a second plurality of holes. A conductive layer is deposited on the top and bottom surfaces of the body and the wall surfaces of the first plurality of holes resulting in the top and bottom surfaces being electrically common. The conductive layer is removed from the wall surfaces of a first subset of the first plurality of holes. A portion of the conductive layer is removed from the top surface of the body and the bottom surface of the body from an area surrounding the first subset of the first plurality of holes.


Find Patent Forward Citations

Loading…