Apex, NC, United States of America

Brian Samuel Beaman

USPTO Granted Patents = 107 


Average Co-Inventor Count = 3.5

ph-index = 33

Forward Citations = 4,968(Granted Patents)

DiyaCoin DiyaCoin 3.80 


Inventors with similar research interests:


Location History:

  • Hude Park, NY (US) (1998 - 2001)
  • Hyde Park, NY (US) (1990 - 2009)
  • RTP, NC (US) (2012)
  • Research Triangle Park, NC (US) (2012)
  • Apex, NC (US) (2000 - 2020)
  • Cary, NC (US) (2008 - 2024)

Company Filing History:


Years Active: 1990-2025

where 'Filed Patents' based on already Granted Patents

107 patents (USPTO):

Title: Brian Samuel Beaman: Innovator Extraordinaire

Introduction:

Brian Samuel Beaman, a highly accomplished inventor based in Apex, NC, has made significant contributions to the field of technological advancements. With an impressive portfolio of 105 patents, Beaman has repeatedly demonstrated his prowess in creating cutting-edge solutions that push the boundaries of innovation and efficiency. Let's take a closer look at his latest patents, career highlights, notable collaborations, and the impact of his work.

Latest Patents:

Among Brian Samuel Beaman's latest patents is the groundbreaking "Off the Module Cable Assembly." This assembly comprises a back shell assembly and a guide block, allowing for the efficient electrical coupling of compression connector portions and cable portions to electronic packages. By utilizing compressed contact wires and springs, Beaman's invention offers a reliable and effective method for connecting cables to electronic devices.

Another recent innovation by Beaman is the "Efficient Placement of Grid Array Components." This patent introduces an interposer that features a metal-plated via spanning the depth of a printed circuit board. By incorporating a solder ball and a metal plug, this invention enhances the placement and connectivity of grid array components, ensuring optimal performance and reliability.

Career Highlights:

Throughout his career, Brian Samuel Beaman has held key positions at renowned companies such as IBM and Lenovo Enterprise Solutions (Singapore) Pte. Ltd. During his tenure, Beaman has been at the forefront of technological advancements, consistently pushing the boundaries of innovation. His expertise in various domains, such as electronic connectivity and grid array placement, has led to numerous breakthroughs that have transformed industries.

Collaborations:

Beaman has collaborated with esteemed professionals within the industry, including Keith E Fogel and Da-Yuan Shih. These partnerships have resulted in the development of groundbreaking technologies, further cementing Beaman's reputation as an exceptional innovator. The combined knowledge, skills, and expertise of these collaborations have played a pivotal role in advancing the field of electronic connectivity and component placement.

Conclusion:

Brian Samuel Beaman is a trailblazing inventor who has made a remarkable impact in the world of technological advancements. With 105 patents to his name, his latest inventions, including the "Off the Module Cable Assembly" and the "Efficient Placement of Grid Array Components," have revolutionized the way we approach electronic connectivity and component placement. Beaman's contributions and collaborations with industry leaders have undoubtedly propelled the field forward, showcasing his exceptional talent and dedication to innovation.

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