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For the Inventor, By the Inventor

Granby, Canada

Jean Audet

USPTO Granted Patents = 37

Average Co-Inventor Count = 4.1

ph-index = 6

Forward Citations = 110(Granted Patents)


Location History:

  • Cranby, CA (2006)
  • Quebec, CA (2007 - 2019)
  • Québec, CA (2018 - 2020)
  • Granby, CA (2002 - 2022)

Company Filing History:

goldMedal37 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal2 out of 8 
 
Kyocera Circuit Solutions Inc.
 patents
where one patent can have more than one assignee

Years Active: 2002-2022

where 'Filed Patents' based on already Granted Patents

37 patents (USPTO):
1. 11388821 - Thin film capacitors for core and adjacent build up layers (2022-07-12),
2. 11209598 - Photonics package with face-to-face bonding (2021-12-28),
3. 10949600 - Semiconductor package floating metal checks (2021-03-16),
4. 10813215 - Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance (2020-10-20),
5. 10806030 - Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance (2020-10-13),
6. 10784202 - High-density chip-to-chip interconnection with silicon bridge (2020-09-22),
7. 10706204 - Automated generation of surface-mount package design (2020-07-07),
8. 10687420 - Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance (2020-06-16),
9. 10660209 - Thin film capacitors for core and adjacent build up layers (2020-05-19),
10. 10622299 - Multi terminal capacitor within input output path of semiconductor package interconnect (2020-04-14),
11. 10460956 - Interposer with lattice construction and embedded conductive metal structures (2019-10-29),
12. 10423751 - Semiconductor package floating metal checks (2019-09-24),
13. 10224274 - Multi terminal capacitor within input output path of semiconductor package interconnect (2019-03-05),
14. 10224273 - Multi terminal capacitor within input output path of semiconductor package interconnect (2019-03-05),
15. 10211174 - Flip chip assembly with connected component (2019-02-19),

Title: Jean Audet: Innovator in Thin Film Capacitors and Photonic Packages

Introduction

Jean Audet, a prolific inventor based in Granby, Canada, boasts an impressive portfolio of 37 patents. His contributions to the fields of electronics and photonics reflect a deep understanding of modern technological needs and advancements.

Latest Patents

Among his latest patents, Audet has developed innovative solutions such as "Thin film capacitors for core and adjacent build-up layers." This invention focuses on a device substrate that employs a core material, where a capacitor sheet is affixed to the surface, featuring openings that accommodate electrical components efficiently. Another notable patent is the "Photonics package with face-to-face bonding," which includes a photonic package incorporating a base substrate with an aperture and integrated circuits, highlighting a sophisticated approach to optoelectronic integration.

Career Highlights

Throughout his career, Jean Audet has collaborated with prominent companies, including IBM and Kyocera Circuit Solutions Inc. His work in these esteemed organizations has facilitated groundbreaking advancements in the field of technology.

Collaborations

Audet has worked alongside notable colleagues, such as Charles L. Reynolds and Luc Gilbert Guerin. Their combined expertise has likely fostered an environment of innovation, enabling the development of advanced technological solutions.

Conclusion

Jean Audet's contributions to innovation in capacitors and photonic packages represent significant advancements in technology. His extensive patent portfolio not only reflects his creativity but also underscores the impact of collaborative efforts within the industry. As he continues to innovate, the technological landscape can expect exciting developments from his endeavors.

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