The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2021
Filed:
Feb. 28, 2019
International Business Machines Corporation, Armonk, NY (US);
Barnim Alexander Janta-Polczynski, Shefford, CA;
Isabel De Sousa, Chambly, CA;
Jean Audet, Granby, CA;
Maryse Cournoyer, Granby, CA;
Sylvain Pharand, St-Bruno de Montarville, CA;
Roxan Lemire, Granby, CA;
Louis-Marie Achard, Granby, CA;
Paul Francis Fortier, Richelieu, CA;
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
A photonic package is provided. The photonic package includes a base substrate defining an aperture, a top die and a photonic integrated circuit (PIC) die. The top die includes a body with first and second top die sections. The first top die section is connectable with the base substrate. The PIC die includes body with first and second PIC die sections. The PIC die is disposable in the aperture such that the second PIC die section is connectable with the second top die section and the first PIC die section extends beyond the second top die section and is exposed for connection to a waveguide assembly.