The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
May. 10, 2019
International Business Machines Corporation, Armonk, NY (US);
Charles L. Arvin, Poughkeepsie, NY (US);
Franklin M. Baez, Fishkill, NY (US);
Brian W. Quinlan, Poughkeepsie, NY (US);
Charles L. Reynolds, Red Hook, NY (US);
Krishna R. Tunga, Wappingers Falls, NY (US);
Thomas Weiss, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An IC device carrier includes organic substrate layers and wiring line layers therein. To reduce stain of the organic substrate layers and to provide decoupling capacitance, one or more decoupling capacitor stiffeners (DCS) are applied to the top side metallization (TSM) surface of the IC device carrier. The DCS(s) reduce the amount of curvature of the IC device carrier and reduce the strain seen by the organic substrate layers, thereby mitigating the risk for cracks forming and expanding or other damage within the carrier. The DCS(s) also include two or more capacitor plates and provides capacitance to electrically decouple electrical subsystems of the system of which the DCS is apart.