The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2016

Filed:

Sep. 27, 2013
Applicant:

Kyocera Slc Technologies Corporation, Yasu-shi, Shiga, JP;

Inventor:

Keizou Sakurai, Yasu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/14 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H05K 3/46 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H01L 23/5389 (2013.01); H05K 3/4697 (2013.01); H01L 23/5385 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1461 (2013.01); H05K 3/3452 (2013.01); H05K 3/4614 (2013.01); H05K 2201/10977 (2013.01); H05K 2201/2018 (2013.01); H05K 2203/0588 (2013.01); H05K 2203/061 (2013.01); Y10T 29/49126 (2015.01);
Abstract

A wiring board includes a base wiring boardand a frame wiring board. The base wiring boardhas an element mounting portionand a frame-shaped frame joining portionon the upper surface and a solder resist layerdeposited in a portion between the element mounting portionand the frame joining portion. In the wiring board, a first joining padprovided in the frame joining portionand a second joining padprovided in a lower surface of the frame wiring boardare joined together via a solder bump H so that a gap may be formed between the frame joining portionand the frame wiring board. The base wiring boardhas a resin injection holepenetrating through the base wiring boardin the frame joining portion, and the gap is filled with a sealing resin


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