The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Dec. 27, 2012
Applicant:
Kyocera Circuit Solutions, Inc., Kyoto, JP;
Inventors:
Takayuki Taguchi, Hikone, JP;
Kenji Terada, Moriyama, JP;
Assignee:
KYOCERA Circuit Solutions, Inc., Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/073 (2006.01); H05K 1/03 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); G01R 3/00 (2006.01);
U.S. Cl.
CPC ...
G01R 1/07307 (2013.01); H05K 1/0271 (2013.01); H05K 1/03 (2013.01); H05K 3/4673 (2013.01); G01R 1/07378 (2013.01); G01R 3/00 (2013.01); H05K 3/0058 (2013.01); H05K 3/4602 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/10409 (2013.01);
Abstract
A wiring boardaccording to the present invention includes a first resin layerformed of a thermoplastic resin; a conductive layerformed partially on the first resin layer; a through hole P for insertion of a screw formed in a region where the conductive layeris not formed and penetrating through the first resin layerin a thickness direction thereof; and a dummy via hole D formed in a region between the through hole P and the conductive layerand penetrating through the first resin layer