The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2016

Filed:

Jun. 27, 2014
Applicant:

Kyocera Slc Technologies Corporation, Yasu-shi, Shiga, JP;

Inventor:

Makoto Shiroshita, Otsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/11 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/113 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 2224/131 (2013.01); H01L 2224/81193 (2013.01); H05K 1/025 (2013.01); H05K 2201/0175 (2013.01); H05K 2201/0317 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/10674 (2013.01);
Abstract

A wiring board according to the present invention is provided with an insulating board and a connection pad, wherein the connection pad includes a main conductor layer formed of a low resistance material, a thin film resistor layer formed of a high resistance material and having a low soldering wettability, and a covering layer having a high soldering wettability, the main conductor layer, the thin film resistor layer, and the covering layer being sequentially laminated at the surface of the insulating layer in such a manner as to be electrically connected in series to each other, and the thin film resistor layer covers a main surface and a side surface of the main conductor layer, and further, a side surface of the thin film resistor layer is exposed from the covering layer.


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