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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9293439 B1

PDFFull Text
Date of Patent:
Mar. 22, 2016

Filed:

Dec. 11, 2014

Electronic module assembly with patterned adhesive array

Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Edmund Blackshear, Wappingers Falls, NY (US);

Elaine Cyr, Granby, CA (US);

Benjamin Vito Fasano, New Windsor, NY (US);

Paul Francis Fortier, Richelieu, CA;

Marcus E. Interrante, New Paltz, NY (US);

Roger Lam, Fishkill, NY (US);

Shidong Li, Poughkeepsie, NY (US);

Thomas Edward Lombardi, Poughkeepsie, NY (US);

Hilton T. Toy, Hopewell Junction, NY (US);

Thomas Weiss, Poughkeepsie, NY (US);

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorney:

Heslin Rothenberg Farley & Mesiti P.C.

Primary Examiner:

Michelle Mandala

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/50 (2006.01); H01L 23/10 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/055 (2006.01); H01L 23/42 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 21/50 (2013.01); H01L 23/10 (2013.01); H01L 23/3675 (2013.01); H01L 23/3736 (2013.01); H01L 23/055 (2013.01); H01L 23/42 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/83862 (2013.01); H01L 2924/15311 (2013.01);
Abstract

An improved electronic module assembly and method of fabrication is disclosed. A patterned array of adhesive is deposited on a laminate, to which a chip is attached. Each region of adhesive is referred to as a lid tie. A lid is placed on the laminate, and is in contact with the lid ties. The lid ties serve to add stability to the laminate and reduce flexing during thermal processing and mechanical stress.

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