The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2015
Filed:
Jun. 05, 2012
Applicant:
Edmund D. Blackshear, Wappingers Falls, NY (US);
Inventor:
Edmund D. Blackshear, Wappingers Falls, NY (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C 51/46 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4803 (2013.01); H01L 21/6835 (2013.01); H01L 24/81 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81192 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A method for shaping a laminate substrate includes characterizing the laminate substrate for warpage characteristics over a range of temperatures. The laminate substrate is placed into a shaping fixture with any necessary correction to obtain a flat laminate substrate chip site area at a chip join temperature. The laminate substrate is shaped at a temperature greater than or equal to a maximum laminate substrate fabrication temperature. The shape of the laminate substrate is retained when it is removed from the shaping fixture.