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For the Inventor, By the Inventor

Ossining, NY, United States of America

Vijayeshwar Das Khanna

This inventor holds 58 USPTO granted patents and 5 published patent applications, primarily in Electronic Packaging (CPC class H01L). Top assignees: International Business Machines Corporation, Hitachi Global Storage Technologies Netherlands B.v., Globalfoundries Inc.. Active years: 1991-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Vijayeshwar Das Khanna. Retrieved from https://idiyas.com/inventor/vijayeshwar-das-khanna

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 58 

% Patents Active = 50.0

Average Co-Inventor Count = 3.9

ph-index = 14

Forward Citations = 559(Granted Patents)

Forward Citations (Not Self Cited) = 542(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Ossining, NY (US) (1991 - 2000)
  • Millwood, NJ (US) (2010)
  • Millwood, KY (US) (2016)
  • Millwood, NY (US) (2004 - 2023)

Company Filing History:

goldMedal41 out of 166,351 
 
International Business Machines Corporation
 patents
silverMedal10 out of 2,636 
 
Hitachi Global Storage Technologies Netherlands B.v.
 patents
bronzeMedal6 out of 5,671 
 
Globalfoundries Inc.
 patents
4. 1 out of 59 
 
Globalfoundries U.S. 2 LLC
 patents

Years Active: 1991-2023

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Areas of Expertise:
Heterogeneous Integration
Solder Interconnect Stress
Thermal Warpage
Heat Transfer Device
Copper Feature Design
Electronic Components
Packaging Substrate
Shock Absorber
Cooling Structures
Integrated Heat Spreader
Warp Modeling
Memory Module Cooling
58 patents (USPTO):Explore Patents
1. 11791270 - Direct bonded heterogeneous integration silicon bridge (2023-10-17),
2. 11570928 - Server node connector mating condition health monitoring and reporting (2023-01-31),
3. 11245075 - Optimum warp in organic substrates (2022-02-08),
4. 10834844 - Server node connnector mating condition health monitoring and reporting (2020-11-10),
5. 10276535 - Method of fabricating contacts of an electronic package structure to reduce solder interconnect stress (2019-04-30),
6. 10276534 - Reduction of solder interconnect stress (2019-04-30),
7. 10108753 - Laminate substrate thermal warpage prediction for designing a laminate substrate (2018-10-23),
8. 9865557 - Reduction of solder interconnect stress (2018-01-09),
9. 9659131 - Copper feature design for warpage control of substrates (2017-05-23),
10. 9630269 - Mechanism to attach a die to a substrate (2017-04-25),
11. 9563732 - In-plane copper imbalance for warpage prediction (2017-02-07),
12. 9550258 - Method and system for thermomechanically decoupling heatsink (2017-01-24),
13. 9508789 - Electronic components on trenched substrates and method of forming same (2016-11-29),
14. 9305894 - Constrained die adhesion cure process (2016-04-05),
15. 9227261 - Vacuum carriers for substrate bonding (2016-01-05),

Title: The Innovative Journey of Inventor Vijayeshwar Das Khanna

Introduction: Vijayeshwar Das Khanna, a talented inventor based in Ossining, NY, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Vijayeshwar Das Khanna holds several patents in various technological domains, including artificial intelligence, renewable energy, and medical devices. His most recent patent focuses on a cutting-edge AI algorithm for predictive maintenance in industrial machinery.

Career Highlights: With a career spanning over two decades, Vijayeshwar Das Khanna has worked for renowned tech companies, leading research institutions, and universities. His expertise in developing innovative solutions has earned him recognition as a pioneer in the industry.

Collaborations: Throughout his career, Vijayeshwar Das Khanna has collaborated with top engineers, scientists, and researchers to bring his inventions to life. His collaborative efforts have resulted in groundbreaking technologies that have revolutionized multiple sectors.

Conclusion: Inventor Vijayeshwar Das Khanna's passion for innovation and dedication to pushing the boundaries of technology have solidified his position as a prominent figure in the world of inventions. His relentless pursuit of excellence continues to inspire future generations of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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