Vijayeshwar Das Khanna

USPTO Granted Patents = 58 (Patent Applications = 2)

Average Co-Inventor Count = 3.9

ph-index = 14

Forward Citations = 557(Granted Patents)

DiyaCoin

= 1.03

Inventors with similar research interests:

Location History:

Ossining, NY (US) (1991 - 2000)
Millwood, NJ (US) (2010)
Millwood, KY (US) (2016)
Millwood, NY (US) (2004 - 2023)

Company Filing History:

41 out of 164,108

International Business Machines Corporation

patents

10 out of 2,636

Hitachi Global Storage Technologies Netherlands B.v.

Globalfoundries U.S. 2 LLC

patents

Years Active: 1991-2023

where 'Filed Patents' based on already Granted Patents

58 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 11791270 - Direct bonded heterogeneous integration silicon bridge (2023-10-17),

2. 11570928 - Server node connector mating condition health monitoring and reporting (2023-01-31),

3. 11245075 - Optimum warp in organic substrates (2022-02-08),

4. 10834844 - Server node connnector mating condition health monitoring and reporting (2020-11-10),

5. 10276535 - Method of fabricating contacts of an electronic package structure to reduce solder interconnect stress (2019-04-30),

6. 10276534 - Reduction of solder interconnect stress (2019-04-30),

7. 10108753 - Laminate substrate thermal warpage prediction for designing a laminate substrate (2018-10-23),

8. 9865557 - Reduction of solder interconnect stress (2018-01-09),

9. 9659131 - Copper feature design for warpage control of substrates (2017-05-23),

10. 9630269 - Mechanism to attach a die to a substrate (2017-04-25),

11. 9563732 - In-plane copper imbalance for warpage prediction (2017-02-07),

12. 9550258 - Method and system for thermomechanically decoupling heatsink (2017-01-24),

13. 9508789 - Electronic components on trenched substrates and method of forming same (2016-11-29),

14. 9305894 - Constrained die adhesion cure process (2016-04-05),

15. 9227261 - Vacuum carriers for substrate bonding (2016-01-05),

Title: The Innovative Journey of Inventor Vijayeshwar Das Khanna

Introduction: Vijayeshwar Das Khanna, a talented inventor based in Ossining, NY, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Vijayeshwar Das Khanna holds several patents in various technological domains, including artificial intelligence, renewable energy, and medical devices. His most recent patent focuses on a cutting-edge AI algorithm for predictive maintenance in industrial machinery.

Career Highlights: With a career spanning over two decades, Vijayeshwar Das Khanna has worked for renowned tech companies, leading research institutions, and universities. His expertise in developing innovative solutions has earned him recognition as a pioneer in the industry.

Collaborations: Throughout his career, Vijayeshwar Das Khanna has collaborated with top engineers, scientists, and researchers to bring his inventions to life. His collaborative efforts have resulted in groundbreaking technologies that have revolutionized multiple sectors.

Conclusion: Inventor Vijayeshwar Das Khanna's passion for innovation and dedication to pushing the boundaries of technology have solidified his position as a prominent figure in the world of inventions. His relentless pursuit of excellence continues to inspire future generations of inventors and innovators.

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2 patents pending:

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