The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9630269 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 25, 2017

Filed:

Oct. 30, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Vijayeshwar D. Khanna, Millwood, NY (US);

Mohammed S. Shaikh, Essex Junction, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); B23K 3/08 (2006.01); H01L 23/00 (2006.01); B23K 1/00 (2006.01); B23K 1/008 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 3/087 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); H01L 24/75 (2013.01); B23K 2201/40 (2013.01); H01L 24/81 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75315 (2013.01); H01L 2224/75318 (2013.01); H01L 2224/75705 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/15787 (2013.01);
Abstract

A mechanism to attach a die to a substrate and method of use are disclosed. The vacuum carrier includes a frame composed of material compatible with solder reflow process. The vacuum carrier further includes a vacuum port extending from a top surface to an underside surface of the frame. The vacuum carrier further includes a seal mechanism provided about a perimeter on the underside surface of the frame of the vacuum carrier. The frame and seal mechanism are structured to maintain a flatness of a die attached to the vacuum carrier by a vacuum source during the solder reflow process.


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