Erwin B Cohen

Title: Celebrating the Innovations of Erwin B. Cohen

Introduction: Erwin B. Cohen, an accomplished inventor residing in South Burlington, VT, has made significant contributions to the field of multi-chip modules. Holding a total of eight patents, his work continues to push the boundaries of technology and innovation.

Latest Patents: Cohen's latest inventions include a split ball grid array pad designed for multi-chip modules, along with a comprehensive method of fabricating these modules. This innovative multi-chip module comprises a substrate with multiple wiring layers, featuring first pads on the top surface and second pads on the bottom surface. The second pads include both a split pad and a conventional pad, showcasing Cohen's forward-thinking designs. His patents detail intricate configurations involving solder balls that enhance the functionality and interconnection of multiple components within these complex systems.

Career Highlights: A key figure at International Business Machines Corporation (IBM), Cohen's role as an inventor has earned him recognition in the technology sector. His expertise in electrical engineering and materials science has driven advancements in multi-chip module technologies, reflecting his commitment to excellence and innovation.

Collaborations: Throughout his career, Cohen has collaborated with esteemed colleagues, including David Brian Stone and Anson Jay Call. This teamwork has fostered an environment of creativity and innovation, contributing to successful projects and groundbreaking patents in the field.

Conclusion: Erwin B. Cohen's relentless pursuit of innovation and excellence marks him as a notable inventor in the realm of multi-chip modules. His contributions not only benefit the technological landscape but also inspire future generations of inventors and engineers striving to create and innovate.