The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Jan. 18, 2018
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Jeffrey P. Gambino, Gresham, OR (US);

Wolfgang Sauter, Burke, VT (US);

Christopher D. Muzzy, Burlington, VT (US);

Charles L. Arvin, Savannah, GA (US);

Robert Leidy, Burlington, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/34 (2006.01); G02B 6/30 (2006.01); G02B 6/124 (2006.01); G02B 6/13 (2006.01); G02B 6/36 (2006.01);
U.S. Cl.
CPC ...
G02B 6/34 (2013.01); G02B 6/124 (2013.01); G02B 6/13 (2013.01); G02B 6/30 (2013.01);
Abstract

The present disclosure relates to semiconductor structures and, more particularly, to photonics chips and methods of manufacture. A structure includes: a photonics chip having a grated optical coupler; an interposer attached to the photonics chip, the interposer having a grated optical coupler; an optical epoxy material provided between the grated optical coupler of the photonics chip and the grated optical coupler of the interposer; and epoxy underfill material provided at interstitial regions between the photonics chip and the interposer which lie outside of an area of the grated optical couplers of the photonics chip and the interposer.


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