The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2022
Filed:
Oct. 11, 2019
Applicant:
Marvell Asia Pte, Ltd., Singapore, SG;
Inventors:
Wolfgang Sauter, Burke, VT (US);
Mark W. Kuemerle, Essex Junction, VT (US);
Eric W. Tremble, Jericho, VT (US);
Assignee:
Marvell Asia Pte, Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); H01L 23/3142 (2013.01); H01L 24/13 (2013.01); H01L 25/0655 (2013.01);
Abstract
The present disclosure relates to semiconductor structures and, more particularly, to partitioned substrates with interconnect bridge structures and methods of manufacture. The structure includes: a plurality of substrates; at least one chip bonded and electrically connected to each of the plurality of substrates; and an interconnect bridge that physically connects the plurality of substrates and electrically connects each of the plurality of chips bonded to each of the plurality of substrates.