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For the Inventor, By the Inventor

Essex Junction, VT, United States of America

Mark William Kuemerle

This inventor holds 29 USPTO granted patents and 11 published patent applications, primarily in Integrated Circuit Design. Top assignees: International Business Machines Corporation, Globalfoundries Inc., Marvell Asia Pte., Ltd.. Active years: 2001-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mark William Kuemerle. Retrieved from https://idiyas.com/inventor/mark-william-kuemerle

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 29 

% Patents Active = 55.2

Average Co-Inventor Count = 3.2

ph-index = 5

Forward Citations = 132(Granted Patents)


Location History:

  • Winooski, VT (US) (2001 - 2009)
  • Essex Junction, VT (US) (2009 - 2022)

Company Filing History:

goldMedal11 out of 166,425 
 
International Business Machines Corporation
 patents
silverMedal10 out of 5,671 
 
Globalfoundries Inc.
 patents
bronzeMedal5 out of 1,237 
 
Marvell Asia Pte., Ltd.
 patents
4. 1 out of 59 
 
Globalfoundries U.S. 2 LLC
 patents
5. 1 out of 1 
 
Marvell Government Solutions, LLC.
 patent
6. 1 out of 5,162 
 
Marvell International Limited
 patents

Years Active: 2001-2026

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Areas of Expertise:
Integrated Circuit
Chip Design
Power Optimization
Temperature Control
Voltage Binning
Multi-Chip Module
Circuit Performance
Embedded Components
Interconnect Structure
Hermetic Barrier
Cooling Solutions
Algorithmic Memory
29 patents (USPTO):Explore Patents
1. 12700889 - Lateral escape using triangular structure of transceivers (2026-08-04),
2. 12696808 - Carrier die with micro channel cooling and embedded components (2026-07-28),
3. 12518079 - Quick floorplanning tool (2026-01-06),
4. 12095494 - Lateral escape using triangular structure of transceivers (2024-09-17),
5. 11282806 - Partitioned substrates with interconnect bridge (2022-03-22),
6. 11037873 - Hermetic barrier for semiconductor device (2021-06-15),
7. 10748852 - Multi-chip module (MCM) with chip-to-chip connection redundancy and method (2020-08-18),
8. 10714411 - Interconnected integrated circuit (IC) chip structure and packaging and method of forming same (2020-07-14),
9. 10381304 - Interconnect structure (2019-08-13),
10. 9875956 - Integrated interface structure (2018-01-23),
11. 9870163 - Double bandwidth algorithmic memory array (2018-01-16),
12. 9865486 - Timing/power risk optimized selective voltage binning using non-linear voltage slope (2018-01-09),
13. 9619609 - Integrated circuit chip design methods and systems using process window-aware timing analysis (2017-04-11),
14. 9552447 - Systems and methods for controlling integrated circuit chip temperature using timing closure-based adaptive frequency scaling (2017-01-24),
15. 9501607 - Composite views for IP blocks in ASIC designs (2016-11-22),

Title: The Innovative Journey of Mark William Kuemerle

Introduction: Mark William Kuemerle, a talented inventor hailing from Essex Junction, VT (US), has made significant contributions to the world of innovations with his creative mind and dedication to problem-solving.

Latest Patents: Mark William Kuemerle holds several patents in various fields, showcasing his versatility and ingenuity in inventing new solutions to complex challenges.

Career Highlights: Throughout his career, Mark William Kuemerle has demonstrated a keen ability to identify gaps in the market and develop groundbreaking inventions to fill those voids. His passion for innovation has led to the creation of several successful products that have improved the lives of many.

Collaborations: Mark William Kuemerle has collaborated with leading experts in the industry, including top researchers, engineers, and designers, to bring his inventions to life. These collaborations have been instrumental in the success of his projects and have helped him achieve groundbreaking results.

Conclusion: Mark William Kuemerle's journey as an inventor is a testament to his unwavering commitment to pushing the boundaries of what is possible through innovation. His impressive portfolio of patents and successful collaborations solidify his position as a prominent figure in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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