The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
May. 24, 2023
Marvell Asia Pte Ltd, Singapore, SG;
John E. Gregory, Jr., Dummerston, VT (US);
Eva Shah Holmes, Wappingers Falls, NY (US);
Carlos Macian Ruiz, Los Gatos, CA (US);
Mark William Kuemerle, Essex Junction, VT (US);
Wolfgang Sauter, Burke, VT (US);
Aatreya Chakravarti, Willston, VT (US);
Samer Michael Akiki, Burlington, VT (US);
MARVELL ASIA PTE LTD, Singapore, SG;
Abstract
A three-dimensional (3D) integrated circuit (IC) includes a plurality of dies, a carrier die, and a plurality of channels embedded in the carrier die. The plurality of dies is stacked in the 3D IC. Each of the dies includes circuitry. The carrier die is disposed above the stacked dies in the 3D IC. The carrier die is configured to provide mechanical support to the stacked dies in the 3D IC. The plurality of channels is configured to carry a coolant to cool the 3D IC.