This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Marvell Asia Pte., Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Eva Shah Holmes: Innovator in 3D Integrated Circuit Technology
Introduction
Eva Shah Holmes is a prominent inventor based in Wappingers Falls, NY (US). She has made significant contributions to the field of integrated circuit technology, particularly in the development of innovative cooling solutions for three-dimensional (3D) integrated circuits.
Latest Patents
Eva holds a patent for a "Carrier die with micro channel cooling and embedded components." This invention involves a 3D integrated circuit (IC) that includes multiple dies stacked together, a carrier die, and embedded channels within the carrier die. The design allows for effective cooling of the 3D IC by circulating coolant through the channels, ensuring optimal performance and reliability.
Career Highlights
Eva is currently employed at Marvell Asia Pte., Ltd., where she continues to push the boundaries of technology. Her work focuses on enhancing the efficiency and functionality of integrated circuits, making her a valuable asset to her team and the industry.
Collaborations
Eva has collaborated with notable colleagues, including Wolfgang Sauter and John E Gregory, Jr. These partnerships have fostered innovation and contributed to the advancement of technology in their field.
Conclusion
Eva Shah Holmes is a trailblazer in the realm of 3D integrated circuits, with her patent showcasing her innovative spirit and technical expertise. Her contributions are paving the way for future advancements in the industry.