The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2018
Filed:
Sep. 26, 2016
Applicant:
Globalfoundries Inc., Grand Cayman, KY;
Inventors:
Wolfgang Sauter, Burke, VT (US);
Mark W. Kuemerle, Essex Junction, VT (US);
Daniel P. Greenberg, Wake Forest, NC (US);
Eric W. Tremble, Jericho, VT (US);
Assignee:
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/04 (2013.01); H01L 24/14 (2013.01); H01L 25/0657 (2013.01); H01L 2223/6644 (2013.01); H01L 2223/6688 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14051 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14134 (2013.01); H01L 2224/14177 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01);
Abstract
The present disclosure relates to interface structures and, more particularly, to integrated interface structures with both parallel and serial interfaces and methods of manufacture. The integrated interface structure includes: a substrate; a plurality of serial interface connections integrated on the substrate; and a plurality of parallel interface connections on the integrated substrate and within spaces between sets of the plurality of serial interface connections.