The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2016
Filed:
Oct. 07, 2015
Globalfoundries Inc., Grand Cayman, KY;
Timothy H. Daubenspeck, Colchester, VT (US);
Jeffrey P. Gambino, Westford, VT (US);
Christopher D. Muzzy, Burlington, VT (US);
Wolfgang Sauter, Richmond, VT (US);
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Abstract
A semiconductor structure with an interconnect level above a substrate and including a conductive pad and a metallic structure, such as a base of a crackstop. A first dielectric layer is above the conductive pad and above the metallic structure. A first opening in the first dielectric layer is aligned with and exposes the conductive pad and a second opening is aligned with and exposes the metallic structure. A metallic liner lines the first opening and the second opening and is on the top surface of the first dielectric layer. A second dielectric layer is above the metallic liner and a third dielectric layer is above the second dielectric layer. A third opening exposes a portion of the metal liner above the conductive pad and a copper plug and pedestal are in the third opening on the exposed portion of the metal liner.