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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9633962 B1

PDFFull Text
Date of Patent:
Apr. 25, 2017

Filed:

Oct. 08, 2013

Plug via formation with grid features in the passivation layer

Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Timothy H. Daubenspeck, Colchester, VT (US);

Jeffrey P. Gambino, Westford, VT (US);

Ekta Misra, Fishkill, NY (US);

Christopher D. Muzzy, Burlington, VT (US);

Wolfgang Sauter, Avon, CO (US);

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorneys:

Thompson Hine LLP

Anthony Canale

Primary Examiner:

Marc Armand

Assistant Examiner:

Tifney Skyles

Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 21/7684 (2013.01); H01L 21/76877 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 25/0657 (2013.01); H01L 2224/03009 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0347 (2013.01); H01L 2224/0361 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03602 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05007 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05023 (2013.01); H01L 2224/0558 (2013.01); H01L 2224/05096 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/11 (2013.01); H01L 2224/11009 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/94 (2013.01); H01L 2924/14 (2013.01);
Abstract

Solder bump connections and methods for fabricating solder bump connections. A passivation layer is formed on a dielectric layer. Via openings extend through the passivation layer from a top surface of the passivation layer to a metal line in the passivation layer. A conductive layer is formed on the top surface of the passivation layer and within each via opening. When the passivation layer and the conductive layer are planarized, a plug is formed that includes sections in the via openings. Each section is coupled with the metal line.

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