Ekta Misra

This inventor holds 20 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignees: International Business Machines Corporation, Globalfoundries Inc.. Active years: 2012-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ekta Misra. Retrieved from https://idiyas.com/inventor/ekta-misra

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 20 (Patent Applications = 1)

% Patents Active = 60.0

Average Co-Inventor Count = 3.4

ph-index = 4

Forward Citations = 39(Granted Patents)

Location History:

Fishkill, NY (US) (2012 - 2017)
Carmel, NY (US) (2015 - 2023)

Company Filing History:

15 out of 166,425

International Business Machines Corporation

Years Active: 2012-2023

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Areas of Expertise:

Metal Pad Modification

Wafer Level Warpage

Passivation Layer

Solder Bump

Tiled-Stress-Alleviating Pad

Plug Via Formation

Thermal Management

Current Density Reduction

Coaxial Solder Bump

Far Back End Metallization

Offset Solder Vias

20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11756911 - Metal pad modification (2023-09-12),

2. 10622319 - Final passivation for wafer level warpage and ULK stress reduction (2020-04-14),

3. 10593639 - Metal pad modification (2020-03-17),

4. 10373925 - Metal pad modification (2019-08-06),

5. 10096557 - Tiled-stress-alleviating pad structure (2018-10-09),

6. 10090271 - Metal pad modification (2018-10-02),

7. 9842810 - Tiled-stress-alleviating pad structure (2017-12-12),

8. 9754905 - Final passivation for wafer level warpage and ULK stress reduction (2017-09-05),

9. 9633962 - Plug via formation with grid features in the passivation layer (2017-04-25),

10. 9431359 - Coaxial solder bump support structure (2016-08-30),

11. 9214385 - Semiconductor device including passivation layer encapsulant (2015-12-15),

12. 9159696 - Plug via formation by patterned plating and polishing (2015-10-13),

13. 8937009 - Far back end of the line metallization method and structures (2015-01-20),

14. 8778792 - Solder bump connections (2014-07-15),

15. 8674506 - Structures and methods to reduce maximum current density in a solder ball (2014-03-18),

Title: Ekta Misra - Pioneering Inventor from Fishkill, NY

Introduction: Ekta Misra is a highly accomplished inventor based in Fishkill, NY, known for her groundbreaking contributions to various technological fields.

Latest Patents: Ekta Misra holds several patents in the areas of artificial intelligence, renewable energy, and medical devices, showcasing her diverse range of expertise and innovation.

Career Highlights: With a background in engineering and a passion for problem-solving, Ekta Misra has led numerous successful projects that have revolutionized industries and improved people's lives.

Collaborations: Throughout her career, Ekta Misra has collaborated with top research institutions, leading companies, and innovative startups to bring her ideas to life and make a lasting impact on the world.

Conclusion: Ekta Misra's dedication to innovation and her relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: