The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

Oct. 19, 2015
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Timothy H. Daubenspeck, Colchester, VT (US);

Jeffrey P. Gambino, Portland, OR (US);

Christopher D. Muzzy, Burlington, VT (US);

Wolfgang Sauter, Burke, VT (US);

Timothy D. Sullivan, Underhill, VT (US);

Assignee:

GlobalFoundries, Inc., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/4763 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 23/3192 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 2224/034 (2013.01); H01L 2224/03845 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05027 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/11011 (2013.01); H01L 2224/1162 (2013.01); H01L 2224/1182 (2013.01); H01L 2224/11472 (2013.01); H01L 2224/11616 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13027 (2013.01); H01L 2924/00012 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/2064 (2013.01);
Abstract

'Thick line dies' that, during manufacture, avoid locating an upstanding edge of a photoresist layer (for example, the edge of a dry film photoresist layer) on top of a 'discontinuity.' In this way solder does not flow into the mechanical interface between the photoresist layer and the layer under the photoresist layer in the vicinity of an upstanding edge of the photoresist layer.


Find Patent Forward Citations

Daubenspeck, Timothy. (2016). Preventing misshaped solder balls (U.S. Patent No. 9331037). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9331037

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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