The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2015
Filed:
Jun. 27, 2013
International Business Machines Corporation, Armonk, NY (US);
Timothy H. Daubenspeck, Colchester, VT (US);
Jeffrey P. Gambino, Westford, VT (US);
Charles F. Musante, Burlington, VT (US);
Christopher D. Muzzy, Burlington, VT (US);
Wolfgang Sauter, Richmond, VT (US);
Timothy D. Sullivan, Underhill, VT (US);
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Abstract
A method including forming a plurality of dicing channels in a front side of a wafer; the plurality of dicing channels including a depth at least greater than a desired final thickness of the wafer, filling the plurality of dicing channels with a fill material and removing a portion of the wafer from a back side of the wafer until the desired final thickness is achieved, where a portion of the fill material within the plurality of dicing channel is exposed. The method further including depositing a metal layer on the back side of the wafer; removing the fill material from within the plurality of dicing channels to expose the metal layer at a bottom of the plurality of dicing channels, and removing a portion of the metal layer located at the bottom of the plurality of dicing channels.