Burlington, VT, United States of America

Charles F Musante

USPTO Granted Patents = 16 (Patent Applications = 4)

Average Co-Inventor Count = 3.6

ph-index = 3

Forward Citations = 20(Granted Patents)

Location History:

South Burlington, VT (US) (2011 - 2014)
Burlington, VT (US) (2015 - 2020)

Company Filing History:

12 out of 164,108

International Business Machines Corporation

Elpis Technologies Inc.

patents

Years Active: 2011-2020

where 'Filed Patents' based on already Granted Patents

16 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 10784137 - Package assembly for thin wafer shipping and method of use (2020-09-22),

2. 10622235 - Package assembly for thin wafer shipping and method of use (2020-04-14),

3. 10615137 - Corrosion resistant aluminum bond pad structure (2020-04-07),

4. 10468280 - Package assembly for thin wafer shipping and method of use (2019-11-05),

5. 10204877 - Corrosion resistant aluminum bond pad structure (2019-02-12),

6. 10163673 - Dual adhesive bonding with perforated wafer (2018-12-25),

7. 10090180 - Package assembly for thin wafer shipping and method of use (2018-10-02),

8. 9953940 - Corrosion resistant aluminum bond pad structure (2018-04-24),

9. 9716010 - Handle wafer (2017-07-25),

10. 9607929 - Tsv wafer with improved fracture strength (2017-03-28),

11. 9543175 - Package assembly for thin wafer shipping and method of use (2017-01-10),

12. 9312205 - Methods of forming a TSV wafer with improved fracture strength (2016-04-12),

13. 9165831 - Dice before grind with backside metal (2015-10-20),

14. 9059111 - Reliable back-side-metal structure (2015-06-16),

15. 8912091 - Backside metal ground plane with improved metal adhesion and design structures (2014-12-16),

Title: Innovator Spotlight: Charles F Musante - Pioneering Innovations in Thin Wafer Shipping

Introduction:

Charles F Musante, a distinguished inventor based in Burlington, VT (US), has made significant contributions to the field of technology with a total of 16 patents to his name. His groundbreaking work in thin wafer shipping solutions has revolutionized the industry.

Latest Patents:

Among his latest patents is the "Package Assembly for Thin Wafer Shipping and Method of Use," which introduces an innovative approach to shipping delicate thin wafers. The package assembly includes a unique wafer container with straps, coupled with upper and lower force distribution plates, ensuring secure transportation.

Career Highlights:

Musante's expertise has been honed through his tenure at renowned companies such as IBM (International Business Machines Corporation) and Globalfoundries Inc. His innovative spirit and dedication to excellence have led to the development of cutting-edge technologies that have had a profound impact on the industry.

Collaborations:

Throughout his career, Musante has collaborated with industry experts such as Jeffrey P Gambino and Damyon L Corbin. These collaborations have not only enriched his projects but have also fostered a culture of innovation and knowledge-sharing within the organizations he has been a part of.

Conclusion:

Charles F Musante's relentless pursuit of innovation and his commitment to pushing the boundaries of technology have solidified his position as a visionary inventor in the field of thin wafer shipping. His pioneering work continues to inspire future generations of innovators and shape the landscape of technological advancements.

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4 patents pending:

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