The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2020
Filed:
Sep. 30, 2019
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Damyon L. Corbin, Jericho, VT (US);
Charles F. Musante, Burlington, VT (US);
Assignee:
ELPIS TECHNOLOGIES INC., Ottawa, CA;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/673 (2006.01); B65B 5/06 (2006.01); B65B 7/16 (2006.01); B65B 61/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67396 (2013.01); B65B 5/06 (2013.01); B65B 7/16 (2013.01); B65B 61/20 (2013.01); H01L 21/67369 (2013.01); H01L 21/67379 (2013.01); H01L 21/67386 (2013.01);
Abstract
A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.