The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2018
Filed:
Jun. 26, 2015
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Charles L. Arvin, Savannah, GA (US);
Jeffrey P. Gambino, Westford, VT (US);
Charles F. Musante, Burlington, VT (US);
Christopher D. Muzzy, Burlington, VT (US);
Wolfgang Sauter, Eagle, CO (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); C22C 21/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); C22C 21/00 (2013.01); H01L 24/03 (2013.01); H01L 24/45 (2013.01); H01L 2224/03452 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05025 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05099 (2013.01); H01L 2224/4502 (2013.01); H01L 2224/48463 (2013.01);
Abstract
A method of manufacturing a bond pad structure may include depositing an aluminum-copper (Al—Cu) layer over a dielectric layer; and depositing an aluminum-chromium (Al—Cr) layer directly over the Al—Cu layer.