The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2014

Filed:

Jan. 10, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Jay S. Burnham, Franklin, VT (US);

Damyon L. Corbin, Jericho, VT (US);

George A. Dunbar, III, Essex Junction, VT (US);

Jeffrey P. Gambino, Westford, VT (US);

John C. Hall, New Hartford, CT (US);

Kenneth F. McAvey, Jr., Winooski, VT (US);

Charles F. Musante, South Burlington, VT (US);

Anthony K. Stamper, Williston, VT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 29/40 (2006.01); H01L 23/498 (2006.01); H01L 21/768 (2006.01); G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76877 (2013.01); H01L 23/49827 (2013.01); G06F 17/50 (2013.01);
Abstract

A backside metal ground plane with improved metal adhesion and methods of manufacture are disclosed herein. The method includes forming at least one through silicon via (TSV) in a substrate. The method further includes forming an oxide layer on a backside of the substrate. The method further includes forming a metalized ground plane on the oxide layer and in electrical contact with an exposed portion of the at least one TSV.


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