The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2015

Filed:

Apr. 11, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Robert D. Edwards, Marlboro, NY (US);

Jeffrey P. Gambino, Westford, VT (US);

Charles F. Musante, Burlington, VT (US);

Ping-Chuan Wang, Hopewell Junction, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 24/27 (2013.01); H01L 21/76898 (2013.01);
Abstract

A semiconductor structure, method of manufacturing the same and design structure thereof are provided. The semiconductor structure includes a substrate including a semiconductor layer and a plurality of TSVs embedded therein. At least one TSV has a TSV tip extending from a backside surface of the substrate. The semiconductor structure further includes a multilayer metal contact structure positioned on the backside surface of the substrate. The multilayer metal contact structure includes at least a conductive layer covering the backside surface of the substrate and covering protruding surfaces of the TSV tip. The conductive layer has a non-planar first surface and a substantially planar second surface opposite of the first surface.


Find Patent Forward Citations

Loading…