The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Mar. 15, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Timothy H. Daubenspeck, Colchester, VT (US);

Jeffrey P. Gambino, Westford, VT (US);

Zhong-Xiang He, Essex Junction, VT (US);

Christopher D. Muzzy, Burlington, VT (US);

Wolfgang Sauter, Hinesburg, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01); H01L 27/08 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 28/40 (2013.01); H01L 23/5223 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 27/0805 (2013.01); H01L 28/60 (2013.01); H01L 2224/13009 (2013.01); H01L 2224/48463 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19041 (2013.01);
Abstract

A metal-insulator-metal (MIM) capacitor using barrier layer metallurgy and methods of manufacture are disclosed. The method includes forming a bottom plate of a metal-insulator-metal (MIM) capacitor and a bonding pad using a single masking process. The method further includes forming a MIM dielectric on the bottom plate. The method further includes forming a top plate of the MIM capacitor on the MIM dielectric. The method further includes forming a solder connection on the bonding pad.


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