International Business Machines Corporation

Globalfoundries Inc.

David L Questad

Timothy Harrison Daubenspeck

Sri Muthuthamby Sri-Jayantha

Wolfgang Sauter

Son K Tran

Jeffrey P Gambino

Thomas Edward Lombardi

Michael A Gaynes

Christopher David Muzzy

David John Russell

Timothy Dooling Sullivan

Frank Daniel Egitto

Vijayeshwar Das Khanna

Luis Jesus Matienzo

Arun Sharma

Douglas Oliver Powell

Lorenzo Valdevit

Thomas Anthony Wassick

Virendra R Jadhav

Karan Kacker

Jeffrey Donald Gelorme

Kamal Kumar Sikka

James L Speidell

Frank Louis Pompeo

Marie-Claude Paquet

Jennifer V Muncy

Donald Merte

Gregg B Monjeau

Robert P Kuder, Ii

Daniel J Littrell

Hilton T Toy

Jon Alfred Casey

Donald Seton Farquhar

Brian Richard Sundlof

William John Rudik

William E Bernier

William Francis Landers

Charles Robert Davis

Edmond Otto Fey

Jamil A Wakil

Jeffrey Thomas Coffin

Valerie A Oberson

Rajinder S Rai

Daniel C Van Hart

Jean Dery

Marek Andrzej Orlowski

Charles Leon Arvin

William Louis Brodsky

Thomas M Shaw

Xiao Hu Liu

Minhua Lu

David Brian Stone

Raschid Jose Bezama

Jeffrey Allen Zitz

Sushumna Iruvanti

Sudipta Kumar Ray

Shidong Li

Krishna R Tunga

Janak G Patel

Mark C H Lamorey

Jean Audet

Peter Jeffrey Brofman

Ian D Melville

Kenneth Charles Marston

Luc Gilbert Guerin

Tuhin Sinha

Michael Joseph Klodowski

George Henry Thiel

James D Herard

Randall Jason Werner

Ashwani K Malhotra

Dae Young Jung

Charles F Carey

Donna Jean Trevitt

Tien Y Wu

Patrick Robert Zippetelli

David Clifford Long

Elbert Emin Huang

Griselda Bonilla

James A Busby

Eric D Perfecto

Steven Lorenz Wright

Bruce John Chamberlin

Paul Francis Fortier

Howard Smith Landis

Krystyna Waleria Semkow

Michael Wayne Lane

Xiaojin Wei

Harry David Cox

Eric Gerhard Liniger

Ekta Misra

Robin A Susko

Stephen Joseph Fuerniss

Paul Robert Walling

Jiantao Zheng

George John Scott

Mitchell G Ferrill

Gary Lafontant

Erwin B Cohen

Jeffrey Alan Zimmerman

An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

Method and apparatus for strain relieving surface mount attached connectors

A symmetrical, flat laminate structure used to minimize variables in a test structure to experimentally gauge white bump sensitivity to CTE mismatch is disclosed. The test structure includes a flat laminate structure. The method of using the test structure includes isolating a cause of a multivariable chip join problem that is adversely impacted by warpage and quantifying a contribution of the warpage, itself, in a formation of the multivariable chip join problem.

Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity

A laminate includes a plurality of buildup layers disposed on a core and a plurality of unit cells defined in the buildup layers. Each unit cell includes: at least one test via that passes through at least two of the buildup layers and that is electrically connected to testing locations on a probe accessible location of the laminate; and two or more dummy vias disposed in the unit cell. The dummy vias are arranged in the unit cell at one of a plurality of distances from the test via.

Test cell for laminate and method

Structures and methods for providing heat sink attachments on existing heat sinks. According to a device, a first heat sink comprises a first base and fins extending from the first base. The first base comprises a cutout therein and a first base bottom surface contacting a first electronic component. A second heat sink comprises a second base and fins extending from the second base. The second heat sink is located in the cutout of the first heat sink. The second base comprises a second base bottom surface contacting a second electronic component. A pressure plate is attached to the first heat sink and overlays the second heat sink. The pressure plate contacts the second heat sink and applies pressure between the second heat sink and the second electronic component.

Heat sink attachment on existing heat sinks

A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.

Fixture to constrain laminate and method of assembly

An electronic module includes a substrate including at least one structure that reduces stress flow through the substrate, wherein the structure includes at least one trench in a surface of the substrate, and a plurality of capacitor legs disposed on an upper surface of the substrate.

Electronic components on trenched substrates and method of forming same

A stacked via structure for reducing vertical stiffness includes: a plurality of stacked vias, each via disposed on a disc-like structure. The disc-like structure includes a platted through hole landing supporting the plurality of stacked vias. The platted through hole landing includes an etched pattern.

Construction of reliable stacked via in electronic substrates&#x2014;vertical stiffness control method

A solder interconnect structure is provided with non-wettable sidewalls and methods of manufacturing the same. The method includes forming a nickel or nickel alloy pillar on an underlying surface. The method further includes modifying the sidewall of the nickel or nickel alloy pillar to prevent solder wetting on the sidewall.

Solder interconnect with non-wettable sidewall pillars and methods of manufacture

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Hopewell Junction, NY, United States of America

David L Questad