International Business Machines Corporation

The Carborundum Company

Other

Crystalline Materials Corporation

Jon Alfred Casey

John Ulrich Knickerbocker

David Clifford Long

Brian Richard Sundlof

Lester W Herron

David B Goland

Govindarajan Natarajan

Subhash Laxman Shinde

Robert Anthony Rita

Glenn A Pomerantz

Gregory M Johnson

Mark J LaPlante

Thomas Anthony Wassick

Srinivasa S Reddy

Kevin M Prettyman

Dinesh Gupta

Charles Leon Arvin

Gareth Geoffrey Hougham

Kamal Kumar Sikka

James N Humenik

Donald Rene Wall

Richard Francis Indyk

Benjamin V Fasano

Raschid Jose Bezama

Robert Hannon

Sarah Huffsmith Knickerbocker

Ian D Melville

Niranjan Mohanlal Patel

Rao Venkateswara Vallabhaneni

Kenneth Charles Marston

James G Balz

Robert W Nufer

Leena Paivikki Buchwalter

Daniel C Edelstein

Xiao Hu Liu

David L Questad

Krystyna Waleria Semkow

Shidong Li

Charles Hampton Perry

Raymond R Horton

Paul F Bodenweber

Brenda Lee Peterson

Lawrence Alfred Clevenger

Timothy Harrison Daubenspeck

Wolfgang Sauter

Arvind Kumar

Paul Stephen Andry

Edmund Juris Sprogis

Michael Stephen Floyd

Joshua M Rubin

Stephen L Buchwalter

Krishna Gandhi Sachdev

Sushumna Iruvanti

Roger Donell Weekly

Sung Kwon Kang

Claudius Feger

Steven Paul Ostrander

John Saunders Corbin, Jr

Shaji Farooq

Sungjun Chun

S Jay Chey

Peter Jeffrey Brofman

David Hirsch Danovitch

Lawrence D David

Brian W Quinlan

Mark William Kapfhammer

Virendra R Jadhav

Michael Joseph Rooks

Robert William Pasco

Charles L Reynolds

Ajay Prabhakar Giri

Sylvain E Ouimet

Carl John Radens

William R Tonti

Daniel Mark Dreps

Kirk David Peterson

Karthick Rajamani

Jeffrey Donald Gelorme

Malcolm Scott Ware

Mark Kenneth Hoffmeyer

David John Russell

George Frederick Walker

Charles Robert Lefurgy

Donald Francis Canaperi

Malcolm Scott Allen-Ware

Eric D Perfecto

Edward William Kiewra

Cornelia K Tsang

Alan J Drake

John Lee Colbert

Michael Wayne Lane

James Patrick Doyle

Jean Audet

Victor V Zyuban

Thomas Edward Lombardi

Chirag Suryakant Patel

Brian Michael Erwin

Luc Gilbert Guerin

Michelle Leigh Steen

Sherif Ahmed Goma

Multicomponent module assembly by identifying a failed site on a laminate comprising a plurality of sites, adding a machine discernible mark associated with the failed site, placing an electrically good element at a successful site; and providing an MCM comprising the laminate, and the electrically good element.

Multicomponent module design and fabrication

An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.

Electronic device console with natural draft cooling

Moisture-driven degradation of a crack stop in a semiconductor die is mitigated by forming a groove in an upper surface of the die between an edge of the die and the crack stop; entirely filling the groove with a moisture barrier material; preventing moisture penetration of the semiconductor die by presence of the moisture barrier material; and dissipating mechanical stress in the moisture barrier material without presenting a stress riser in the bulk portion of the die. The moisture barrier material is at least one of moisture-absorbing, moisture adsorbing, and hydrophobic.

Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers

An electronic system includes two integrated circuit (IC) packages that are connected by a package to package (PP) connector. The PP connector may include cabling between a first cabling connector and a second cabling connector. The first cabling connector may be seated to a first carrier connector upon a first IC device carrier of the first IC device package. The second cabling connector may be seated to a second carrier connector upon a second IC device carrier of the second IC device package. The electronic system may further include a heat sink connected to the IC packages, to the first cabling connector, and to the second cabling connector. An IC device may route I/O data through the PP connector, effectively increasing the number of I/O routes.

Polygon integrated circuit (IC) packaging

Direct bonding heterogeneous integration packaging structures and processes include a packaging substrate with first and second opposing surfaces. A trench or a pedestal is provided in the first surface. A bridge is disposed in the trench or is adjacent the pedestal sidewall, wherein the bridge includes an upper surface coplanar with the first surface of the package substrate. At least two chips in a side by side proximal arrangement overly the bridge and the packaging substrate, wherein the bridge underlies peripheral edges of the at least two chips in the side by side proximal arrangement. The at least two chips include a plurality of electric connections that are directly coupled to corresponding electrical connections on the bridge and on the packaging substrate.

Direct bonded heterogeneous integration packaging structures

Semiconductor structures are provided in which a first chip on a substrate has at least one first protruding section, the first protruding section including first interconnect locations, a second chip on the substrate having at least one second protruding section, the second protruding section including second interconnect locations and the first chip and the second chip are arranged such that the first protruding section is interdigitated with the second protruding section.

Fins for enhanced die communication

A laminate includes a buildup layer having a top and a bottom and a solder mask contacting the top. The laminate also includes a circuit element disposed on the top of the buildup layer and at least partially covered by the solder mask, the circuit element including a first via formed therein that allows for a power signal provided to an underside of the circuit element to be provided to a first connection on a top of the circuit element.

Under die surface mounted electrical elements

A mechanism is provided for determining a modeled age of a set of interconnect groups in a set of cores in a set of multi-core processors. For each interconnect group in the set of interconnect groups in the set of cores on the set of multi-core processors, a determination is made of a current modeled age of the interconnect group. A determination is then made as to whether at least one current modeled age of the interconnect group for the set of interconnect groups is greater than an end-of-life value. Responsive to at least one current modeled age of the interconnect group being greater than the end-of-life value, an indication to take corrective action with the at least one associated interconnect group is sent.

Managing interconnect electromigration effects

A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material.

Passivation layer surface topography modifications for improved integrity in packaged assemblies

A multi-chip module (MCM) includes chip sub-modules that are fabricated as self-contained testable entities. The chip sub-modules plug into respective sockets in a frame of the MCM. Each chip sub-module may be tested before being plugged into the MCM. A chip sub-module may include an IC chip, such as a processor, mounted to an sub-module organic substrate that provides interconnects to the chip. The frame into which each chip sub-module plugs sits on a mini-card organic substrate that interconnects the chip sub-modules together. The MCM may include a downstop between the mini-card organic substrate and a system board to limit or prevent solder creep of solder connections between the mini-card organic substrate and the system board.

Multi-chip module system with removable socketed modules

A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.

Achieving mechanical and thermal stability in a multi-chip package

Growing community of inventors

Poughkeepsie, NY, United States of America

Jon Alfred Casey