The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2014
Filed:
Oct. 22, 2010
Jon Alfred Casey, Poughkeepsie, NY (US);
John Lee Colbert, Byron, MN (US);
Paul Marian Harvey, Austin, TX (US);
Mark Kenneth Hoffmeyer, Rochester, MN (US);
Charles L Reynolds, Red Hook, NY (US);
Jon Alfred Casey, Poughkeepsie, NY (US);
John Lee Colbert, Byron, MN (US);
Paul Marian Harvey, Austin, TX (US);
Mark Kenneth Hoffmeyer, Rochester, MN (US);
Charles L Reynolds, Red Hook, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A multi-chip module (MCM) includes chip sub-modules that are fabricated as self-contained testable entities. The chip sub-modules plug into respective sockets in a frame of the MCM. Each chip sub-module may be tested before being plugged into the MCM. A chip sub-module may include an IC chip, such as a processor, mounted to an sub-module organic substrate that provides interconnects to the chip. The frame into which each chip sub-module plugs sits on a mini-card organic substrate that interconnects the chip sub-modules together. The MCM may include a downstop between the mini-card organic substrate and a system board to limit or prevent solder creep of solder connections between the mini-card organic substrate and the system board.