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For the Inventor, By the Inventor

Byron, MN, United States of America

John Lee Colbert

USPTO Granted Patents = 42 


Average Co-Inventor Count = 3.8

ph-index = 12

Forward Citations = 394(Granted Patents)


Location History:

  • Rochester, MN (US) (2012)
  • Byron, MN (US) (1999 - 2016)

Company Filing History:

goldMedal42 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 1999-2016

where 'Filed Patents' based on already Granted Patents

42 patents (USPTO):
1. 9456506 - Packaging for eight-socket one-hop SMP topology (2016-09-27),
2. 9445507 - Packaging for eight-socket one-hop SMP topology (2016-09-13),
3. 9265157 - Implementing heat sink loading having multipoint loading with actuation outboard of heatsink footprint (2016-02-16),
4. 8958214 - Motherboard assembly for interconnecting and distributing signals and power (2015-02-17),
5. 8747122 - Implementing connection of two large electronic boards utilizing LGA interconnect (2014-06-10),
6. 8680670 - Multi-chip module system with removable socketed modules (2014-03-25),
7. 8446738 - Motherboard assembly for interconnecting and distributing signals and power (2013-05-21),
8. 8363404 - Implementing loading and heat removal for hub module assembly (2013-01-29),
9. 8267701 - Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housing (2012-09-18),
10. 7985095 - Implementing enhanced connector guide block structures for robust SMT assembly (2011-07-26),
11. 7944698 - Mounting a heat sink in thermal contact with an electronic component (2011-05-17),
12. 7903411 - Cold plate stability (2011-03-08),
13. 7777329 - Heatsink apparatus for applying a specified compressive force to an integrated circuit device (2010-08-17),
14. 7765693 - Electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member (2010-08-03),
15. 7751918 - Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates (2010-07-06),

Title: Innovations of John Lee Colbert: A Visionary in SMP Topology

Introduction

John Lee Colbert, based in Byron, MN, is a prominent inventor with an impressive portfolio of 42 patents. His contributions to technology, particularly in the realm of symmetric multiprocessor (SMP) topology, have significantly advanced the field. Currently, he works at the International Business Machines Corporation (IBM), where he continues to develop cutting-edge solutions.

Latest Patents

One of Colbert's latest patents involves a groundbreaking packaging system for an eight-socket one-hop SMP topology. This innovative mechanism plays a crucial role in efficiently packaging a multiple socket architecture. It connects various processor modules to a multiple-socket planar through land grid array (LGA) connectors. Additionally, it provides connectivity to a redistribution card, optimizing the entire configuration. Such advancements enhance the processing capabilities and efficiency of computing systems.

Career Highlights

Throughout his career, John Lee Colbert has been dedicated to pushing the boundaries of technology. His expertise in SMP topology has led to numerous patents that exemplify his innovative spirit. Colbert has consistently focused on improving hardware performance and addressing complex computational challenges, cementing his reputation as a leader in his field.

Collaborations

Colbert has collaborated with a talented group of coworkers at IBM, including Arvind Kumar Sinha and Roger Duane Hamilton. These partnerships have fostered a creative environment where innovation thrives, allowing them to tackle challenging projects and contribute collectively to the advancement of technology.

Conclusion

John Lee Colbert's work as an inventor at IBM is a testament to his passion for innovation and technology. With a solid foundation of 42 patents and ongoing contributions, Colbert continues to shape the future of symmetric multiprocessor systems. His dedication and collaborative efforts with fellow innovators ensure that he remains at the forefront of technological advancements.

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