The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2012
Filed:
May. 19, 2010
Brian S. Beaman, RTP, NC (US);
William L. Brodsky, Endicott, NY (US);
John L. Colbert, Rochester, MN (US);
Mark K. Hoffmeyer, Rochester, MN (US);
Yuet-ying Yu, Poughkeepsie, NY (US);
Brian S. Beaman, RTP, NC (US);
William L. Brodsky, Endicott, NY (US);
John L. Colbert, Rochester, MN (US);
Mark K. Hoffmeyer, Rochester, MN (US);
Yuet-Ying Yu, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An apparatus is disclosed for aligning socket housing segments for an area array device. Each socket housing segment includes at least a first surface and a second surface, with the second surface opposite the first surface. The second surface of each socket housing segment provides electrical connections for a portion of the area array device. Socket contact pads are disposed on the first surfaces of the plurality of socket housing segments. The socket contact pads correspond to substrate contact pads disposed on a substrate. One or more alignment structures are disposed at a space between the socket housing segments. Each alignment structure is coupled to at least two of the socket housing segments. The one or more alignment structures maintain a predetermined alignment of each socket housing segment so that the socket contact pads align with the substrate contact pads during a surface mount connection process.